Lex System MIRO 3 - 3I610CW (3 Layer) - DIN bėgelyje montuojama įterptinė (DIN-Rail Mountable Embedded) sistema, Intel Skylake-U / Kaby Lake-U, skirta integruoti į spinteles ir skydelius
Kodas: MIRO 3 - 3I610CW (3 Layer)Užsakoma prekėDinrail Mountable Embedded System, Intel® Skylakeu / Kaby Lakeu, Designed For Panel And Cabinet Integration With 2 Lan And 6 Com Ports
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MIRO 3 - 3I610CW (3 Layer) DIN bėgelio sistema turi Intel® Skylake-U / Kaby Lake-U kompaktiškame profilyje, skirtame tiesiogiai montuoti spinteles. Siūlo 2 GbE LAN, 4 x USB USB 3.x, 6 COM prievadus ir DIN Rail Kit plėtimą su 9~36V maitinimu. Idealus pastatų automatizavimui, pramoniniams valdymo skydeliams ir energijos valdymui.
The MIRO 3 - 3I610CW (3 Layer) DIN-rail system features Intel® Skylake-U / Kaby Lake-U in a compact profile designed for direct cabinet mounting. It provides 2 GbE LAN, 4 x USB USB 3.x, 6 COM ports, and DIN Rail Kit expansion, with 9~36V wide-voltage power. Ideal for building automation, industrial control panels, and energy management systems.



